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XPedite8070

P.A. Semi Dual-Core PWRficient PA6T-1682 Processor-Based VPX-REDI Module

XPedite8070

Features

  • VPX (VITA 46) 3U module
  • Ruggedized Enhanced Design Implementation (REDI)
  • Conduction or air cooling
  • P.A. Semi PWRficient PA6T-1682 processor with dual PA6T Power Architecture cores at up to 2.0 GHz each
  • PCI Express, 10 Gigabit Ethernet XAUI, and Gigabit Ethernet P1
  • Up to 1 GB of NAND flash
  • Two channels of DDR2-400 ECC SDRAM, up to 2 GB (1 GB each)
  • Up to 4 MB of LPC NOR flash
  • Dual Gigabit Ethernet
  • XMC or PrPMC interface
  • Dual RS-232/RS-422 serial P2 ports
  • Linux LSP
  • VxWorks BSP

Description

The XPedite8070 is a high-performance 3U VPX-REDI single-board computer based on the P.A. Semi PWRficient PA6T-1682 processor. With two PA6T Power Architecture cores running at up to 2.0 GHz each and dissipating less than 17 Watts, the PA6T-1682 delivers optimum performance-per-watt while providing high-performance communication to two DDR2 SDRAM channels and a plethora of network interfaces, making the XPedite8070 ideal for ruggedized systems requiring high bandwidth processing and low power consumption.

The XPedite8070 supports two separate channels of up to 1 GB each of DDR2-400 ECC SDRAM, as well as up to 1 GB of NAND flash. The XPedite8070 provides the option of utilizing PCI Express, 10 Gigabit Ethernet XAUI, and Gigabit Ethernet P1 interconnects. The XPedite8070 also supports dual Gigabit Ethernet, GPIO, I²C, PMC I/O, XMC I/O, and dual RS-232/RS-422 ports through the P2 connector.

The XPedite8070 provides a feature-rich solution to support the next generation of rugged embedded applications. Both a VxWorks Board Support Package (BSP) and a Linux 2.6 LSP are available.

Technical Specifications

XPedite8070 Block Diagram

Processor

  • P.A. Semi PWRficient PA6T-1682 processor
  • Dual PA6T Power Architecture cores at up to 2.0 GHz each
  • 2 MB of shared L2 cache

Memory

  • Two channels of DDR2-400 ECC SDRAM, up to 2 GB (1 GB each)
  • Up to 1 GB of NAND flash
  • Up to 4 MB of LPC NOR flash
  • 128 KB of NVSRAM

VPX (VITA 46) P1 Backplane Options

  • PCI Express
  • 10 Gigabit Ethernet XAUI
  • Gigabit Ethernet

VPX (VITA 46) P2 I/O

  • Dual Gigabit Ethernet ports
  • Dual RS-232/RS-422 serial ports
  • Dual SGMII ports
  • I²C port
  • Six GPIO signals

Software Support

  • Linux LSP
  • VxWorks BSP

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm

Environmental Requirements

  • Air-cooled operating temperature: -40 to 70 ºC (ambient)
  • Conduction-cooled operating temperature: -40 to 85 ºC (at thermal interface)
  • Humidity: 0% to 85% ºC
  • Storage temperature: -40 to 105 ºC

Power Requirements

  • 34 Watts

Ruggedization

  • Air-cooled: VITA 47 Class V1, 20g shock
  • Conduction-cooled: VITA 47 Class V3, 40g shock

Extreme Engineering Solutions, Inc.

3225 Deming Way, Suite 120
Middleton, WI 53562
Phone: 608-833-1155
Fax: 608-827-6171
E-mail: sales@xes-inc.com
Web: http://xes-inc.com