XPedite7301

The XPedite7301 is a high-performance, low-power XMC module based on the Intel® Core™i7 processor and Intel QM57 chipset. With up to three PCI Express ports and a Gigabit Ethernet port, the XPedite7301 is ideal for high-bandwidth data-processing applications.

The XPedite7301 accommodates up to 8 GB of DDR3 ECC SDRAM to support memory-intensive applications and hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, and RS-232/RS-422/RS-485.

Wind River VxWorks, QNX Neutrino, Linux, and Green Hills INTEGRITY Board Support Packages (BSPs), as well as Windows drivers, are available for the XPedite7301.

• Intel Core i7-610E, -620LE, and -620UE processors
• Dual-core with hyper-threading technology
• XMC module
• Conduction or air cooling
• Up to 8 GB of DDR3-1066 ECC SDRAM in two channels
• 32 MB NOR boot flash
• Up to 16 GB of NAND flash
• Two x4 or one x8 PCI Express P15 XMC interface
• One x4 PCI Express P16 XMC interface
• Gigabit Ethernet port with integrated magnetics
• Four USB 2.0 high-speed ports
• Two SATA 3.0 Gb/s ports
• Two RS-232/RS-422/RS-485 serial ports
• DVI-D video
• Audio line in/out port
• Linux BSP
• VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Microsoft Windows drivers

Click on the image above to view a larger version.

Processor

• Intel Core i7 processor operating at 2.53, 2.0, or 1.06 GHz
• Dual-core with hyper-threading technology
• Intel QM57 chipset
• Dual channel integrated memory controller
• Integrated graphics controller
• 4 MB of shared cache

Memory

• Up to 8 GB of DDR3-1066 ECC SDRAM
• 32 MB NOR boot flash
• Up to 16 GB of NAND flash

P14 PMC Interface

• Two USB 2.0 ports
• Two RS-232/RS-422/RS-485 ports
• One 10/100/1000BASE-T Ethernet port
• Four GPIO signals
• One audio in/out port

P15 XMC Interface

• One x8 or two x4 PCI Express links

P16 XMC Interface

• One DVI-D display
• Two USB 2.0 ports
• Two SATA 3.0 Gb/s ports
• One x4 PCI Express link

Software

• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Microsoft Windows drivers

Physical Characteristics

• XMC form factor
• Dimensions: 149 mm x 74 mm, 10-mm stacking height

Environmental Requirements

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements (Estimate)

• 20 W (1.06 GHz)

Accessories

• XTend204 (90070330) - Debug Module with JTAG/Serial/LPC Cable
• XTend207 (90070400) - Debug Module with JTAG/Serial/Ethernet/USB Cable