XPedite7040

Intel® Core™ Duo or Intel® Core™2 Duo Processor-Based AMC Module

The XPedite7040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single board computer designed to provide maximum performance and I/O options while minimizing power consumption. The Ultra Low Voltage (ULV) Intel Core Duo processor or Low Voltage (LV) Intel Core 2 Duo processor provides the XPedite7040 with a significant performance-per-watt processing advantage. Additionally, the Intel 3100 chipset combines the functionality of an integrated server-class memory controller (Northbridge) and an I/O controller (Southbridge) into a single device that is specifically intended for power- and board-space-sensitive embedded applications.

The XPedite7040 can be installed in an AdvancedTCA (ATCA) AMC.0-compliant carrier or a MicroTCA.0 (µTCA)-compliant backplane. The XPedite7040 supports an AMC.1 x4 PCI Express interface, dual AMC.2 Gigabit Ethernet 1000BASE-BX interfaces, and dual AMC.3 SATA interfaces. Additional serial and GPIO is provided through the backplane connector.

The XPedite7040 supports two PC3200 SO-RDIMM modules and 4 GB of NAND flash for ample on-card memory capacity. 4 MB of Firmware Hub (FWH) space is also supported for redundant BIOS or OS kernel storage.

  • Intel Core Duo or Intel Core 2 Duo processor at up to 1.5 GHz
  • Intel 3100 chipset
  • Front panel Gigabit Ethernet port
  • Front panel RS-232 serial port
  • Front panel USB 2.0 port
  • Complies with AMC.0 and MicroTCA.0 (µTCA)
  • AMC.1 x4 PCI Express interface
  • AMC.2 dual Gigabit Ethernet 1000BASE-BX interfaces
  • AMC.3 dual SATA interfaces
  • Two PC3200 SO-RDIMMs, up to 8 GB
  • 4 GB of NAND flash
  • Up to 4 MB of Firmware Hub (FWH) storage
  • AMI BIOS
  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Microsoft Windows drivers
XPedite7040 Block Diagram

Click on the image above to view a larger version.

Processor

  • Intel Core Duo or Intel Core 2 Duo processor
  • Up to 1.5 GHz
  • Up to 4 MB L2 cache
  • Up to 166 MHz (667 MT/s) FSB

Memory and I/O Controller Hub

  • Intel 3100
  • DDR2-400 ECC SDRAM
  • 4 GB of NAND flash
  • 4 MB of Firmware Hub (FWH) storage

AMC Backplane Interconnect

  • Complies with AMC.0 and MicroTCA.0 (µTCA)
  • AMC.1 x4 PCI Express interface
  • AMC.2 dual Gigabit Ethernet 1000BASE-BX interfaces
  • AMC.3 dual SATA interfaces
  • Dual USB 2.0 interfaces
  • RS-232/RS-422 serial interface

Front Panel I/O

  • Micro DB-9, RS-232 serial port
  • USB 2.0 port
  • 10/100/1000BASE-T Gigabit Ethernet port

Software

  • AMI BIOS
  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Microsoft Windows drivers

Physical Characteristics

  • Single-width, mid-size, or full-size AMC
  • Dimensions: 180 mm x 75 mm

Environmental Requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1
  • Conformal coating available as an ordering option

Power Requirements

  • Less than 30 Watts

Accessories

  • XTend202 (90070170) - Debug Module with LPC Cable
  • Adapter (70003555) - Serial, Mini-USB to DB-9 (Female)

Additional Information