XPand3200

Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules

The XPand3200 redefines the limits of power, performance, and functionality in a sub-½ ATR system. This conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today's avionics and ruggedized environments, size really does matter, and the XPand3200 sets a new standard for sub-½ ATR computing.

Depending on your processing requirements, the XPand3200 can be populated with high-performance, low-power 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third party modules.

An optional SATA SSD memory module provides the convenience of removable storage and the ruggedness of solid-state memory at up to 64 GB. An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28V DC or 115V AC input. Internal EMI filtering and hold up for up to 60-ms at 200 W are also provided.

  • ½ ATR compliant, conduction-cooled chassis (reduced height and length)
  • Physical dimensions of 4.88 in. (W), 5.62 in. (H), 8.75 in. (L)
  • 3U VPX and cPCI backplanes available
  • Optional front-panel USB port
  • Optional SATA SSD memory module with easy removal and insertion
  • Optional PCI Express fabric backplane
  • Optional Gigabit Ethernet switched backplane
  • Configurable rear panel I/O connectors
  • Integration services with third-party modules available
  • Up to 200 W from a MIL-STD-704 28V DC or 115V AC source
  • MIL-STD-461 E/F EMI filtering
  • Environmentally sealed
  • Internal holdup of up to 60 ms at 200 W
XPand3200 Block Diagram

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Physical Characteristics

  • ½ ATR-compliant, conduction-cooled chassis (reduced height and length)
  • 4.88 in. (W), 5.62 in. (H), 8.75 in. (L)

Backplane Options

  • 3U VPX
  • 3U cPCI
  • Custom backplane solutions available

Front Panel I/O Options

  • USB 2.0- and 1.0-compliant interface
  • Three user-defined push buttons
  • Removable SATA SSD storage media bay with high-reliability connector
  • Custom front panel I/O

Back Panel I/O Options

  • Up to three D38999 circular connectors for I/O
  • DVI graphics interfaces
  • USB 2.0- and 1.0-compliant interfaces
  • 10/100/1000BASE-T Gigabit Ethernet interfaces
  • RS-232/RS-422 serial links
  • MIL-STD-1553
  • ARINC-429
  • Custom I/O via XMC/PMC modules
  • Custom I/O via third party modules

Power Supply Options

  • MIL-STD-704 28V DC input voltage support (default)
  • MIL-STD-704 115-AC input voltage support
  • Up to 60 ms internal hold-up time at 200 W
  • Up to 110 ms internal hold-up time at 120 W
  • Additional power supply options available

Additional Information